Achieve flawless BGA reballing results with our precision-engineered U-QSD11 reballing stencil, specifically designed for Samsung Galaxy S23 series chipsets (SM6450, SM8550, SM8650). This professional-grade stainless steel stencil ensures perfect solder ball alignment for CPU, GPU, and other BGA component repairs.
Key Features:
✔ Laser-Cut Precision – Micron-level accuracy for perfect solder ball placement
✔ High-Temp Stainless Steel – Withstands repeated rework cycles without warping
✔ Multi-Chip Compatibility – Works with SM6450 (Exynos), SM8550 (Snapdragon 8 Gen 2), SM8650 chips
✔ Reusable Design – Durable construction for long-term workshop use
✔ OEM-Spec Alignment – Matches factory solder ball patterns exactly
Why Choose Our U-QSD11 Stencil?
This Samsung Galaxy S23 reballing stencil is essential for professional repair technicians, featuring:
- Anti-static coating to prevent component damage
- Optimized thickness (0.2mm) for perfect solder height
- Clear alignment markers for foolproof positioning
Technical Specifications:
- Material: 304 Stainless Steel
- Thickness: 0.2mm ± 0.01mm
- Compatibility: SM6450/Exynos 2200, SM8550/Snapdragon 8 Gen 2, SM8650
- Surface Treatment: Anti-oxidation coating
Package Includes:
- 1× U-QSD11 Reballing Stencil
- 1× Cleaning Cloth
- 1× Alignment Guide
Upgrade your Samsung chipset repair toolkit with this industry-approved reballing solution today!
Compatibility Agreement
Important Notes
Professional Repairs: It’s recommended to have this repair done by a qualified technician, especially if you don’t have experience with Consumer Electronics/gadget disassembly.
- ⚠️ Warning: You Must Backup Your Data Before Repair Process
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