Achieve flawless motherboard repairs with our BGA Reballing Middle Layer Stencil for Samsung Galaxy S22 Ultra. This professional-grade tool ensures perfect alignment for BGA chip reballing and replacement, making it essential for technicians and repair shops.
Key Features:
✔ Laser-Cut Precision – High-accuracy alignment for perfect solder ball placement
✔ Premium Stainless Steel – Durable, warp-resistant, and long-lasting
✔ S22 Ultra-Specific Design – Made exclusively for Samsung Galaxy S22 Ultra (SM-S908)
✔ Reusable & Scratch-Proof – Cost-effective for repeated repairs
✔ Compatible with Rework Stations – Works seamlessly with BGA machines and hot air guns
This BGA Reballing Stencil for Samsung S22 Ultra guarantees professional results, whether you’re fixing water damage, overheating issues, or faulty connections.
Why Choose Our BGA Reballing Stencil?
- Saves Time & Effort – Reduces errors and rework
- Improves Repair Success Rate – Ensures proper chip connections
- Trusted by Professionals – Used in repair centers worldwide
Upgrade your repair toolkit today with this must-have BGA Reballing Middle Layer Stencil for Samsung Galaxy S22 Ultra!
Compatibility Agreement
Important Notes
Professional Repairs: It’s recommended to have this repair done by a qualified technician, especially if you don’t have experience with Consumer Electronics/gadget disassembly.
⚠️ Warning: You Must Backup Your Data Before Repair Process
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